
第6/第7世代Intel®Core™SシリーズおよびIntel®Xeon®E3(FCLGA1151ソケット)DINレールボックスコンピュータ
| System | |
| CPU | 6th/7th Gen Intel® Xeon® E3/Core™ S (formerly Skylake/Kaby Lake) |
| LGA1151 socket type CPU (supports TDP upto 35W) | |
| Chipset | Intel®C236 Chipset |
| Memory | 2x DDR4 SO-DIMM Max. 64GB (Skylake:DDR4-2133; Kaby Lake: DDR4-240 |
| Graphic | Xeon®: HD Graphics P530 (Skylake)/P630 (Kaby Lake) |
| Core™ I Series: HD Graphics 530(Skylake)/630 (Kaby Lake) | |
| Pentium®/Celeron®: HD Graphics 510 (Skylake)/610 (Kaby Lake) | |
| BIOS | AMI 128Mbit SPI BIOS |
| AI Controller (AIC) | AI for system monitoring and predictiveanalysis |
| Watchdog Timer | Runtime: 10 ? 65535 seconds |
| Powerup: 120 ? 65535 seconds | |
| TPM (optional) | SLB9665 (TPM 2.0) / SLB9635 (TPM 1.2) |
| Power | |
| DC Input | 9~36VDC |
| Surge Protection | 200V/1ms |
| Power in Protection | Reverse-Voltage, Over-Voltage,Under-Voltage, Over-Current |
| Remote/Ignition | 1x ATX power on/off switch, 5-pin terminal block including 3-pin remotecontrol and 2-pin ignition signals (pitch 3.81 mm) |
| Power Mode | AT/ATX (BIOS setting) |
| Mechanical | |
| Dimensions (W x D x H) | 102(W) x 206(D) x 243(H) mm (4.01" x8.11" x 9.57") |
| Weight (net/gross) | 4.5kg |
| Mounting | DIN rail mount, wall mount bracket andfoot stand |
| Construction | Aluminum and metal chassis with fanlessdesign |
| Battery | Easily replaceable RTC battery holder |
| Dynamic Display Module (DDM) | 0.96 inch LCM work with AIC to display system status |
| ExternalIO | |
| DisplayPorts / Resolution | 2x DP /4096x2304@60Hz |
| 1x DVI/1920x1200@60Hz | |
| 1x VGA/1920x1200@60Hz | |
| TripleDisplay Ports Combinations | 2x DP + 1x DVI |
| 2x DP + 1x VGA | |
| 1x DP + 1x DVI + 1x VGA | |
| Ethernet | 6x RJ45 GbE (1x Intel®i219+ 5x Intel®i210) / Wake-on-LAN and PXE/ i219 supports iAMT 11.0 (AIHD) |
| 2x RJ45 GbE (1x Intel®i219+ 5x Intel®i210) / Wake-on-LAN and PXE/ i219 supports iAMT 11.0 (AIHDP) | |
| PoE | 4x RJ45 GbE PoE+ (Intel®i210 ) 802.3at support up to 30W (AIHDP) |
| USB 3.0/2.0 | 6x USB 3.0 ports via native XHCIcontroller (0.9A each port) |
| COM | 1x RS-232/422/485 (auto flow control), 1xRS-232 port |
| Digital I/O | 32-bit programmable DIO (AIHD, AIHDP) |
| 16-bit programmable DIO, isolated 8-bit DI & 8-bit DO, Sink/SourceMode, 5~48V, 100mA (AIHD-i, AIHDP-i) | |
| 16-bit isolated DI & 16-bit isolated DO, Sink/Source Mode, 5~48V,100mA (AIHD-i2, AIHDP-i2) | |
| Audio | ALC892 HD Audio Codec, Mic in, Line out |
| SIM | 3x SIM push-push slots |
| Storage | |
| Internal Drive Bay | 3x internal SATA port for 2.5” HDD/SSD |
| mSATA | 3x full length mSATA (muxed withMini-PCIe) |
| Removable Drive Bay | NA |
| RAID Mode | RAID 0/1/5 |
| ExpansionSlot | |
| Mini-PCIe | 3x full length Mini-PCIe (muxed withmSATA, auto detection) |
| Other | |
| USB 2.0 Dongle | Internal 1x USB 2.0 for dongle securitykey |
| Antenna | 4x antenna openings |
| LED | Power status, HDD status, IO status |
| Environment | |
| Operating Temperature | Standard: -20°C to 50°C (-4°F~122°F),supports CPU TDP up to 35W |
| Extended temperature: -25°C to 70°C (-13°F~158°F) (For more information, please contact yourrepresentative) | |
| Storage Temperature | -40°C to 85°C (-40°F to 185°F) |
| Relative Humidity | 95% @ 40°C (104°F), non-condensing |
| Vibration During Operation (IEC60068-2-64:Random 5~500Hz) | 5Grms with SSD; 1Grms with HDD |
| ShockDuring Operation (IEC60068-2-27: Half Sine, 11ms Duration) | 50Grms with SSD; 20Grms with HDD |
| Certification | |
| EMC | CE/FCC Class A |
| Safety Certifications | CB |
| OSSupport | |
| Optional OS Installation | Windows 7 32-bit/64-bit (Skylake only) |
| Windows 8.1 32-bit/64-bit (Skylake only) | |
| Windows Embedded Standard 7(Skylake only) | |
| Windows Embedded 8 Standard (Skylake only) | |
| Windows 10 64-bit | |
| Windows 10 IoT | |
| Linux |
株式会社PALTEK 半導体事業部
CPUモジュール問い合わせ窓口


