SI-613

標準クラス

530統合インテル®HDグラフィックス・3つのHDMI搭載の第7/6世代Intel®Core™プロセッサーベース4Kサイネージプレーヤー

System Mainboard	MBD613
CPU Type	Intel® Skylake-S DT processors (14nm monolithic) TDP <=65W
CPU Socket	LGA1151(Socket H4)
Chipset	H170/Q170 PCH
Memory	2x DDR4 2133 SO-DIMM, dual channel, Max. 32GB
Graphics	Intel® HD integrated Graphics
LAN	1x Intel® I219LM Gigabit LAN controller for Q170 1x Intel® I219V Gigabit LAN controller for H170
Expansion Slots	1x M.2 B key (3042) for storage or 4G LTE options 1x Mini PCI-E (full-size) for Wi-Fi, Bluetooth or 4G LTE 1x SIM card slot
I/O Interface	3x HDMI 2.0 with Hardware EDID emulation 2x USB 3.0 2x USB 2.0 1x RJ45 for Gigabit LAN 1x RJ45 for RS-232 serial port 2x Audio connectors for Mic in / Line out Power / HDD LED, 1x power button 1x power jack connector
Auto Control and Monitoring	Watchdog Timer: 256 segments, 0,1,2…255 (sec/min)
Power Requirement	+12V DC
Construction	Aluminum + SGCC
Weight	2.2kgs (4.85lbs)
Chassis Color	Black & white
Storage	1x NGFF M.2 M key 22 x 80mm (2280)
Power Supply	150W power adaptor
Mounting	Slim design with wall mounting holes
Dimensions	215.6mm(W) x 215.6mm(D) x 40mm(H) 8.49”(W) x 8.49”(D) x 1.57”(H)
Operating Temperature	0°C ~ 45 °C (32 ~ 113 °F) (CPU TDP <=45W) 0°C ~ 40°C (32°F~104°F) (CPU TDP=65W)
Storage Temperature	-20°C ~ 80°C (-4°F~176°F)
Relative Humidity	5~90% @ 45°C, (non-condensing)
Vibration	M.2: 5 grms / 5~500Hz / random operation
Certification	CE, FCC class B, cULus & CCC
Operating System Support	Win7 32/64-bit, Win8.1 64-bit, Win10 64-bit Enterprise

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