SI-313-N

標準クラス

次世代AMD Radeon™HDグラフィックスと3つのHDMI搭載第3世代AMD組み込みRシリーズAPUベースサイネージプレーヤー

System Mainboard	MBD313
CPU Type	AMD R-Series 28nm Quad-Core/Dual-Core APU The maximum TDP supported is 15W
CPU Package	FP4 BGA package, 37mm x 29mm, 0.8mm pitch
Chipset	AMD integrated SoC
Memory	2x DDR4-2133 SO-DIMM, Dual channel, Max. 32GB
Graphics	Next-Gen AMD Radeon™ HD GPU integrated
LAN	1x RTL8111G Gigabit LAN controller
Expansion Slots	1x M.2 B key (3042) for storage or 4G LTE options 1x Mini PCI-E (full-size) for Wi-Fi, Bluetooth or 4G LTE 1x SIM card slot
I/O Interface	3x HDMI 2.0 with Hardware EDID emulation 1x RJ45 for Gigabit LAN 1x RJ45 for RS-232 serial port 2x USB 3.0 2x USB 2.0 2x Audio connectors for Mic in / Line out Power / HDD LED, 1x power button 1x power jack connector
Auto Control and Monitoring	Watchdog Timer: 256 segments, 0,1,2…255 (sec/min)
Power Requirement	+12V DC
Construction	Aluminum + SGCC
Weight	1.55kgs (3.42lbs)
Chassis Color	Black & white
Storage	1x M.2 M-Key(2280)
Power Supply	84W power adaptor
Mounting	Standard system bracket
Dimensions	216mm(W) x 150mm(D) x 33mm(H) 8.5”(W) x 5.91”(D) x 1.3”(H)
Operating Temperature	0°C ~ 45°C (32°F~113°F)
Storage Temperature	-20°C ~ 80°C (-4°F~176°F)
Relative Humidity	10%~90% (non-condensing)
Vibration	M.2: 5 grms / 5~500Hz / random operation
Certification	CE, FCC class B, cULus & CCC
Operating System Support	Windows® 7 (32/64-bit), Windows 8.1† (64-bit) Windows 10 (64-bit), Windows 10 IOT Enterprise (64-bit) Windows Embedded Standard 7 (32/64-bit) Windows Embedded Standard 8 (32/64-bit) Linux Open Source (64-bit)

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