
標準クラス
次世代AMD Radeon™HDグラフィックスと3つのHDMI搭載 第3世代AMD組み込みRシリーズAPUベースサイネージプレーヤー
| System Mainboard | MBD313 | 
| CPU Type | AMD R-Series 28nm Quad-Core/Dual-Core APU *The maximum TDP supported is 35W*  | 
| CPU Package | FP4 BGA package, 37mm x 29mm, 0.8mm pitch | 
| Chipset | AMD integrated SoC | 
| Memory | 2x DDR4-2133 SO-DIMM, Dual channel, Max 32GB | 
| Graphics | Next-gen AMD Radeon™ HD GPU integrated | 
| LAN | 1x Realtek RTL8111G Gigabit LAN controller | 
| Expansion Slots | 1x M.2 B key(3042) for storage or 4G LTE options 1x Mini PCI-E (full-size) for Wi-Fi, Bluetooth or 4G LTE 1x SIM card slot  | 
| I/O Interface | 3x HDMI 2.0 with Hardware EDID emulation 1x RJ45 for Gigabit LAN 1x RJ45 for RS-232 serial port 2x USB 3.0 2x USB 2.0 2x Audio connectors for Mic in / Line out Power / HDD LED, 1x power button 1x power jack connector  | 
| Auto Control and Monitoring | Watchdog Timer: 256 segments, 0,1,2…255 (sec/min) | 
| Power Requirement | +12V DC | 
| Construction | Aluminum + SGCC | 
| Weight | 1.55kgs (3.42lbs) | 
| Chassis Color | Black & white | 
| Storage | 1x M.2 M-Key(2280) | 
| Power Supply | 150W power adaptor | 
| Mounting | Standard system bracket | 
| Dimensions | 216mm(W) x 150mm(D) x 33mm(H) 8.5”(W) x 5.91”(D) x 1.3”(H)  | 
| Operating Temperature | 0°C ~ 45°C (32°F~113°F) | 
| Storage Temperature | -20°C ~ 80°C (-4°F~176°F) | 
| Relative Humidity | 10%~90% (non-condensing) | 
| Vibration | M.2: 5 grms / 5~500Hz / random operation | 
| Certification | CE, FCC class B, cULus & CCC | 
| Operating System Support | Windows® 7 (32/64-bit), Windows 8.1† (64-bit) Windows 10 (64-bit), Windows 10 IOT Enterprise (64-bit) Windows Embedded Standard 7 (32/64-bit) Windows Embedded Standard 8 (32/64-bit) Linux Open Source (64-bit)  | 
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